State of the art system for electrical characterisation of multicrystalline ingots in fabs with high throughput. Total measurement time of less than two minutes at one millimeter resolution, two ingot sides simultaneously. Lifetime, photoconductivity, resistivity, p/n, and geometrical surface integrity maps at the same time.

MDP inline ingot - fast ingot mapping system for high throughput multicristalline silicon fabs

State of the art system for electrical characterisation of multicrystalline ingots in fabs with high throughput. Measurement time of less than two minutes at one millimeter resolution, two ingot sides at the same time, lifetime, resistivity and p/n equal map at the same time.

Customer defined ingot cut criteria can be transmitted to the fab database which allows for a fully automated material monitoring for next generation photovoltaic fabs. Enables material quality control and monitoring of furnace homogeneity, performance and failure analysis.

Facts

  • contactless destruction free electrical semiconductor characterisation

  • mapping capability of minority carrier lifetime, photoconductivity

  • advanced sensitivity for visualisation of so far invisible defects

  • automated cut criteria definition

two dimensional ingot mapping system for solar grade silicon one millimeter resolution, measurement time: one ingot in 2 minutes, two surfaces at a time

Detail

  • ingot maps and linescans @ 2 min a ingot 1 min resolution

  • parameter autosetting

  • sample: ingot

  • sample size: between 156 x 156 mm² (other sizes on request)

  • maximum length 500 mm

  • resistivity: 0.1 - 10³ Ohm cm

  • conduction type: p, n

  • material: multi- or monocrystalline silicon

  • properties measureable: lifetime (steady state or non equilibrium(μ-PCD) selectable)

  • excitation: 980 nm default

options

  • resistivity map 1 cm² resolution

  • p/n equal map 1 mm² resolution

  • iron mapping capability