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Electrical semiconductor characterization
Luminescence dating, research, dosimetry and more
Free radical measurements in life science and biomedical applications
Offline tool for very versatile contactless electrical characterization of semiconductor wafers or partially processed wafers....
State of the art system for topographic electrical characterization of multicrystalline bricks in fabs with high throughput....
Production integrated high speed wafer mapping of carrier lifetime. Single wafer topograms in less than one second a wafer.
Low cost table top lifetime measurement system for characterization of a variety of different silicon samples at different...
Mono- and Multi-crystalline wafer and brick lifetime measurement device
Flexible OEM unit for lifetime measurements at a variety of different samples ranging from mono- to multicrystalline silicon...
is a modification of MDP, where temperature dependent measurements of the defect part of the transient are accomplished.
The minority carrier life time is sensitive for all kinds of electrically active defects in semiconductors and is therefore...
MDP is an advanced technology with a so far unsurpassed combination of sensitivity, speed and resolution for fab and lab...
benchtop PID test solution
for fast and routine production level quality control of solar cells
user friendly and advanced operating software
The PIDcon devices are designed to investigate the PID susceptibility for production monitoring of solar cells as well as tests...
Learn more about the reasons for PID and the how the susceptibility of solar cells, mini modules and encapsulation materials can...
for ultra-fast crystal orientation and rocking curve measurements
flexible diffractometer for ultra-fast Omega Scan orientation determination
for AT, SC, FC, IT cut Blanks
three generations of X-ray engineers
in industrial production, R&D and more
discover the most convenient way of measuring orientation of single crystals
The microelectronic industry drives present global technological developments. It is one reason for the success of information...
Solar Energy is one of the key elements for the energy revolution that is currently taking place all over the world. In the last...
Research and development is the driving force for the expanding market for semiconductor products in the PV and microelectronic...
The impact of the development of the crystal growth methods on modern technology is often underestimated. We use products...
Freiberg Instruments is one of the world's fast growing, young and dynamic analytical instrumentation companies
Technical support, Training, Warranty, Consultation, Seminars, Upgrades and more
Our quality management system is an integrated process-oriented system with ISO 9001 certification.
going the extra mile
at Freiberg Instruments
Solutions for the Quartz industry
Laser control and correction of the surface orientation; Sorting into groups with an adjustable angle interval down to ±7.5 arc seconds; Blank size 4.5 to 10 mm; Thickness down to 60 µm; StDV (standard deviation) better than 6 arc seconds; Throughput 1000 blanks per hour. Multiple measurements possible.
Laser control and correction of the surface orientation; Sorting into groups with an adjustable angle interval down to ±7.5 arc seconds; Blank size 0.8 x 1 mm2 to 3 mm; Thickness down to 50 µm; StDV better than 6 arc seconds; Throughput 1000 blanks per hour; Multiple measurements possible.
X-ray measurement according to the well-known W-scan method combined with laser-reflection surface control; Cutting angle measurement at a selected number of inspection points along the surface of AT-cut quartz wafers; semiautomatic wafer feeding and sorting system. Reproducibility about 3 arc seconds. Minimal distance of inspection points 1mm. Maximal wafer size round or rectangular 75 mm.
Laser control and correction of the surface orientation; Sorting into groups with an adjustable angle interval down to ±5 arc seconds; Blank size 8 to 16 mm. Thickness down to 80 µm. StDV for theta better than 2 arc seconds, for phi better than 10 arc seconds; Throughput 60 blanks per hour; Multiple measurements possible
Laser control and correction of the surface orientation; One side non-linear surface configurations possible; Sorting into groups with an adjustable angle interval down to ±5 arc seconds; Blank size 6 to 15 mm; Thickness down to 80 µm; StDV for theta better than 2 arc seconds, for phi better than 10 arc seconds; Throughput 200 blanks per hour; Multiple measurements possible.
Slicing of quartz bars is most effective when a high number of bars can be processed in one single step. Our machine is a special design for building stacks of up to 6×5 lumbered quartz bars.
Bars are filled into a magazine and are then automatically transported, measured, X-ray adjusted and then pressed against and fixated into a stack. UV-light is used to cure the adhesive glue.
Sorting of quartz blanks for AT, SC, FC, IT cut
In the production of oscillators and filters the cutting of blanks from bars is an essential step for achieving the right cutting angle of the blanks that influences the temperature behavior of the final product.