Ingot XRD

state-of-the-art XRD system for automatic single crystal ingot orientation, tilting and alignment for grinding

 

Si | SiC | AlN | Sapphire (Al2O3) | GaAs | Quartz | LiNbO3 | BBO and 100 more materials

Features of Ingot XRD

  • Highest precision

  • Measurement speed: < 5 secs/sample 

  • Typical standard deviation tilt (example: Si 100):   < 0.003 °, minimum < 0.001 °

  • Automatic ingot alignment

  • Automatic positioning of glue pieces

  • Optical determination of geometric features (flat/notch position) of raw and/or grinded ingots

  • Automatic marking of ingots

  • Easy integration into process line (manual or robotic loading)

  • Data Matrix Code (DMC) reader

  • MES interface; SECS/GEM or similar

  • up to 300 mm diamter and up to 520 mm lenght ingots

 

Optical determination of geometric features (flat/notch position)

ParameterStandard deviation
Diameter< 6 µm (grinded ingots);  < 30 µm (raw ingots)
Notch/Flat postion< 0.01°
Notch depth< 6 µm
Notch opening angle< 1.5°
X-ray axis Vs. Flat/Notch position< 0.02°
Ingot length> 0.1 mm

 

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