Revolutionize your ingot post glueing preparation: Automated, precise and modular
Ultra-fast hybrid X-ray optical metrology with proprietary algorithm
Robot driven operations with modular metrology and tooling
Advanced factory connectivity and service provisions
Materials
The Ingot XRD SiC delivers high-throughput and precision for the efficient production of advanced SiC wafers.
Features & Benefits
Unmatched
Quality
with hybrid metrology
0.005˚
On-axis precision
Flexible
Loading and communication options
Diameter
100–300
mm