Ingot XRD SiC

Automated 200 mm SiC ingot preparation for high-end OD/Notch grinding

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Revolutionize your SiC ingot grinding preparation – ultra precise and built for factory automation.

Rapid crystal orientation: Automated XRD measurement precisely determines the crystal orientation of 200 mm SiC ingots.
Integrated geometry inspection: A confocal optical sensor captures OD and notch geometry for accurate grinding preparation.
Flexible automation concept: Choose between fully automated material handling with an integrated robot or seamless integration with third-party automation.

Materials

Ingot XRD SiC is purpose-built for precise and automated processing of SiC ingots.

SiC

Features & Benefits

200 mm

SiC ingot processing

Hybrid
Metrology

XRD and optical geometry inspection

Fully
Automated

Gluing and holder attachment

5 boules/h

Oriented gluing throughput

5 boules/h

Oriented gluing throughput

Ingot XRD SiC combines X-ray crystal orientation, optical geometry inspection and automated handling in one integrated workflow for 200 mm SiC ingots. From measurement and alignment to gluing and oriented cropping, the system provides precise and repeatable preparation for high-end OD and notch grinding.

Fast measurement, automated process control and flexible factory integration enable reliable material flow while reducing manual handling and improving process reproducibility.

Rapid crystal orientation: Automated XRD measurement precisely determines the crystal orientation of 200 mm SiC ingots.
High-precision geometry inspection: An integrated confocal sensor measures OD and notch geometry for accurate grinding preparation and control.
Automated oriented gluing: Crystal and geometry data are directly transferred into precise ingot alignment, adhesive dispensing and holder attachment.
Controlled adhesive process: Automated two-component adhesive mixing, programmable dispensing patterns and camera-based inspection ensure reliable and repeatable gluing quality.

Automated material handling: In the fully automated configuration, an integrated robot handles ingots and holders throughout the process, minimizing manual intervention and ensuring consistent process execution.
Oriented cropping: Tilted top and bottom slabs can be cropped according to the measured crystal orientation.
Grinding quality control: Crystal orientation and geometry can be verified after OD and notch grinding.
High throughput: Up to 2 oriented and glued boules per hour.
Flexible automation: Ingot XRD SiC is available with an integrated robot for fully automated material handling or prepared for third-party automation using an external robot.

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Specifications

Precision (SiC)	0.005°/<0.02° (1σ) on off-cut (tilt) and in-plane (twist)
XRD	Omega scan X-ray crystal orientation (5s/measurement)
Geometry	Notch (optical sensor)
Materials	SiC
Samples	Ingots, boules (200 mm diameter)
Automation	Integrated robotic handling and post glueing (5 boules/hour) Ready for third-party automation
Fab communication	SECS/GEM
Processes	Ingot grinding and cropping preparation BPS: oriented glueing OD-grind: grinding quality control SmartPuck: oriented slab cropping
Dimension	Customizable to suit your fab layout and requirements