Epitaxial Layers & Thin Films

Guaranteeing specifications in Semiconductor front-end processes

Analyze wafer properties during wafering and front-end processes

Near-surface wafer properties play a crucial role in determining the outcomes of subsequent processes. Tight control over structural and electronic conditions is essential to prevent yield loss during this critical phase.

Using XRD series, you precisely control crystal cuts, ensuring consistent quality for device processing every day. With MDP series and HR-SPS series, you monitor the recombination behavior of optically generated charge carriers.

This approach supports a wide range of applications, from optoelectronics to power and logic devices!

Key Advantages

Manual or automated

Whether for R&D or Quality Control, we offer the flexibility to integrate metrology units with automation solutions or design cost-efficient, streamlined standalone systems.

Highest precision

Our unmatched combination of precision, speed, and modularity sets us apart. Put our method to the test with your application – challenge us to deliver!

Material flexibility

We offer solutions for almost any thin film or bulk material system with a band gap. Challenge us with your process requirements – we're ready to innovate!

Onsite service and training

Reduce your total cost of ownership by participating in our on-site training program! We empower you to perform first- and second-line servicing on your tools, ensuring maximum uptime and full control over your process – no matter your location or access limitations.

Offcut management for front-end processes

Implement 100% wafer offcut entry control for your front-end processes. This enables you to screen offcuts from materials like SiC or InP substrates, ensuring optimal results in epitaxy, lithography, and ion implantation.

Single crystal rocking curve

With an optional module, you can activate an essential X-ray metrology feature. Perform baseline quality control using X-ray rocking curves and analyse the FWHM of SiC wafers.