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Use precise wafer orientation data where it creates the most value.

  • Fast and precise measurement: Hybrid X-ray and optical metrology delivers reliable orientation data within production workflows.

  • Designed for fab automation: SMIF loadports, OHT-ready handling and flexible communication options enable seamless integration.

  • Ready for changing requirements: Process wafer sizes from 70 to 300 mm and a wide range of crystalline materials.

Materials

One platform for multiple wafer materials. Measure a wide range of crystalline wafer materials with one flexible metrology platform.

Si SiC Ge GaAs GaN Ga₂O₃ Diamond InP and more

Features & Benefits

70–300 mm

Scalable wafer size range

0.003˚

Offcut magnitude precision

Flexible

Loading and communication options

Opt. sensors

Integrated wafer geometry detection

Opt. sensors

Integrated wafer geometry detection

XRDmap Pro measures crystal orientation and wafer geometry directly within the production flow. Its precise data helps manufacturers tune downstream processes such as epitaxy, lithography and ion implantation to the actual wafer orientation. 

The result: more consistent process conditions, reliable supplier compliance and efficient material flow across automated wafer production.

  • SMIF loadports enable automated wafer loading in production environments

  • OHT-ready handling supports seamless material flow across automated production lines

  • High-resolution mapping with up to 1,000 measurement pointsreveals local orientation variations across the entire wafer surface

  • High-throughput operation processes up to 60 wafers per hour for efficient inline quality control

  • Hybrid X-ray and optical metrology (Omega Scan) delivers fast, precise wafer orientation data

  • Optical sensors capture wafer geometry as a reliable measurement reference

  • Rocking curve measurements at each mapped wafer position provide detailed insights into local crystal quality

  • The integrated interface provides clear access to measurement workflows and results

  • Operator mode enables safe, streamlined measurements with predefined parameters

  • Customizable recipes adapt measurement workflows to different materials and processes

  • Automatic result visualization accelerates evaluation and orientation correction

Discover XRDmap Pro

See how XRDmap Pro combines automated wafer handling, hybrid metrology and production-ready software in one integrated system.

With an offcut magnitude precision better than 0.003°, XRDmap Pro delivers benchmark-leading measurement results to optimize downstream processes such as epitaxy, lithography and ion implantation.

Dr. Christian Hagendorf
Key Account Manager

Interested? Our experts are happy to assist you.

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Specifications

Precision0.003°/<0.03° (1σ) on off-cut (tilt) and in-plane (twist)
XRDOmega scan X-ray crystal orientation (5s/measurement)
GeometryNotch (optical sensor) 
Materials
  • Si, SiC, Ge, GaAs, GaN, Ga2O3, Diamond, InP and more 
Samples70 – 300 mm wafer
Measurements
AutomationRobot handling (60 wafers/hour), 2 SMIF ports
Fab communicationSECS/GEM
ProcessesEpitaxy, lithography, ion implantation
Dimension (w × h × d)2250 × 1250 × 2476 mm

Get in touch

Do not hesitate to contact us – we are available to assist you with any inquiries or requests.

Use our inquiry tool or reach out via email:
sales@freiberginstruments.com