Use precise wafer orientation data where it creates the most value.
Fast and precise measurement: Hybrid X-ray and optical metrology delivers reliable orientation data within production workflows.
Designed for fab automation: SMIF loadports, OHT-ready handling and flexible communication options enable seamless integration.
Ready for changing requirements: Process wafer sizes from 70 to 300 mm and a wide range of crystalline materials.
Materials
One platform for multiple wafer materials. Measure a wide range of crystalline wafer materials with one flexible metrology platform.
Features & Benefits
70–300 mm
Scalable wafer size range
0.003˚
Offcut magnitude precision
Flexible
Loading and communication options
Opt. sensors
Integrated wafer geometry detection
Applications

With an offcut magnitude precision better than 0.003°, XRDmap Pro delivers benchmark-leading measurement results to optimize downstream processes such as epitaxy, lithography and ion implantation.
Dr. Christian Hagendorf
Key Account Manager










