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High-precision mapping system based on THz time-domain spectroscopy designed for epitaxial layers on highly doped materials

  • Non-Destructive & Non-Contact

  • Optimized for thin layers on Highly Doped substrates

  • High spatial resolution of 1mm

Materials

THzmap is specialized on highly doped materials.

Si SiC GaN

Features & Benefits

Sigma < 1 %

Very good repeatability

± 5 %

Accuracy depending on thickness

Throughput
> 5 Wafers

per hour

3 mm

Edge exclusion

3 mm

Edge exclusion

In semiconductor manufacturing, the difference between peak performance and failure lies in the micrometer range. Our latest Mapping System, powered by Terahertz Time-Domain Spectroscopy (THz-TDS), delivers a breakthrough in characterization – specifically engineered for epitaxial layers on challenging, highly doped substrates.

Breaking the Conductivity Limit

Traditional optical and eddy current methods often struggle with the high absorption and conductivity of heavily doped substrates. Our THz-TDS technology utilizes reflection-mode measurement to bypass these limitations, allowing for ultra-precise analysis of epi-layers where transmission-based systems fail.

Measure with zero risk of surface contamination or mechanical damage to your wafers. Visualize electrical homogeneity across the entire wafer with spatial resolutions down to 1 mm, identifying process drifts before they impact yield. Replace slow, destructive methods like Mercury-CV or SIMS with a rapid, inline-capable THz solution.

Our THz-TDS Mapping System provides the critical data needed to optimize reactor performance, minimize scrap, and ensure the reliability of power electronics and RF components.
 

In semiconductor manufacturing, the difference between peak performance and failure lies in the micrometer range. Our latest Mapping System, powered by Terahertz Time-Domain Spectroscopy (THz-TDS), delivers a breakthrough in characterization – specifically engineered for epitaxial layers on challenging, highly doped substrates.

  • For bulk samples: 0.1 to 100 ohm cm

  • For epitaxial layers: 8 × 1015 cm-3 to 4 × 1018 cm-3

THzmap enables to measure the unmeasurable – accurate epi resistance on highly doped substrates.

Dr. Nadine Schüler
Head of Research & Development

Interested? Our experts are happy to assist you.

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Specifications

Measured parameterResistivity / doping density
Measurement principleContactless and non-destructive Terahertz Time-Domain Spectroscopy (THz-TDS)
ResultFull wafer maps
Resolution1 mm
Measurement time20 min for 12’’ wafer
Power supply100 250 V (± 10), 5A, single phase
Dimension (w × h × d)670 × 490 × 810 mm
Minimum sample size10 × 10 mm
Maximum sample sizeWafers up to 150 mm diameter 
(larger on request)
Sample thickness
  • > 10 µm for epitaxial layers
  • Up to 1 mm for bulk samples

Supported by

Our Partners

Accessories & Options

  • Automation of sample handling possible

Get in touch

Do not hesitate to contact us – we are available to assist you with any inquiries or requests.

Use our inquiry tool or reach out via email:
sales@freiberginstruments.com