CN

Wafer XRD

for fully automated sorting, sample crystalline orientation, sample dimension, optical notch/flat and edge profile determination and more

 

Si | SiC | GaN | AlN | GaAs | InP |Sapphire (Al2O3) | Quartz  and many more materials

Features of Wafer XRD

  • Fully automated wafer handling and sorting system (eg: cassette to cassette)

  • Crystal orientation and resistivity measurements

  • Optical determination of geometric features (notch position, notch deep, notch opening angle, diameter, flat position and flat length) of wafers

  • Distance measurement for unpolished wafers and mirroring surfaces

  • MES and/or SECS/GEM interfaces

Established Omega-scan method

  • Highest precision

  • Measurement speed: < 5 secs/sample 

  • Easy integration into process line

  • Typical standard deviation tilt (example: Si 100):   < 0.003 °, minimum < 0.001 °
     

Contact us for more information.

 

Downloads

  • Fully automated wafer sorting and handling system

MPD series / µPCD

µPCD/MDP (QSS)

PID series

PID

XRD series / X-ray diffraction

X-ray diffraction

Branches

Projects

Projects

Company

Company