• Photocarrier generation and separation mechanisms

  • Minority carrier lifetime measurement/Diffusion length calculations

  • Trapped carrier dynamics, time resolved

  • Surface Photovoltage measurements

Figure 1 shows an example using SPV for the characterization of the polishing process on the double-side polished high-resistivity float zone silicon wafer. The red areas in the plots clearly show that the CMP polishing process is not optimal and even signatures of a handling tool are clearly visible in the plots (left below). 


Matching Products

Get in touch

Do not hesitate to contact us – we are available to assist you with any inquiries or requests.

Use our inquiry tool or reach out via email:
sales@freiberginstruments.com