Back from Yokohama – with many good conversations and one clear takeaway: as SiC technologies become more advanced, precise process control becomes increasingly important throughout the manufacturing chain.
This year’s ICSCRM put topics such as superjunction devices, implantation processes, epitaxial quality, defect engineering and interface control firmly in focus. Many of them connect directly with the metrology we work on every day at Freiberg Instruments.
→ Crystal orientation: With increasingly complex implantation and epitaxy processes, precise wafer orientation matters. XRDmap Pro provides fast, automated X-ray orientation measurements for reliable crystallographic alignment.
→ Surface and interface characterization: HR-SPSmap uses contactless surface photovoltage measurements to investigate charge dynamics, electronic transitions and surface/interface properties across wafers and epitaxial layers.
→ Material quality and defects: MDPmap combines highly sensitive minority-carrier lifetime and photoconductivity mapping to visualize material quality, epitaxial uniformity and process-induced changes.
→ Deep-level defect characterization: MDpicts enables temperature-dependent, contactless analysis of electrically active defect states – without the need to fabricate electrical contacts.
The common thread: better understanding of materials and processes requires fast, sensitive and non-destructive metrology – from research to production.
Thank you to everyone who stopped by our booth, exchanged ideas and shared current challenges with us. It was great to be part of ICSCRM again – and we’re looking forward to continuing the conversations started in Yokohama.
