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Lexsyg Software LexStudio 2.0 - Operating software Modern, professionally designed user interfacensitivity: Based on user feedback a new graphical user interface which combines clear arrangement and usability is developed by Freiberg… Learn more LexEva - Evaluation software LexEva is a newly released evaluation software developed for analysis in luminescence research and dating. LexEva was adapted to the "Luminescence" package developed by the R. Luminescence… Learn more TLStudio - Operating & Evaluation software User account management system, Transperent workflow, Professionally designed user interface, Intelligent parameter selection, Live data visualization, Easy programming of individual and… Learn more OSLdosimetry OSLdosimetry is a user friendly operating software which allows OSL dose measurements as standard user or calibration and setting features for professionals (password protected). The… Learn more

Skip breadcrumb navigation Breadcrumb Freiberg Instruments Products Luminescence Dating and Dosimetry lexsygsmart Configuration options Red stimulated quartz OSL Red stimulated quartz OSL allows a separation of the fast OSL component in thermally optically stimulated (TM-OSL) mode Interested? Get in touch! Contact now Following Chruścińska et.al. (2018) and Palczewski & Chruścińska (2019) the stimulation of quartz at 620 nm allows a separation of the fast OSL component in thermally optically stimulated (TM-OSL) mode. Red OSL at 620 nm is now available for lexsyg TL/OSL reader . Chruścińska, A., Szramowski, A., Thermally modulated OSL related to the fast component of the OSL signal in quartz, Radiat. Meas. 120, (2018), 20-25. Palczewski P & Chruścińska A (2019) Different components of the quartz OSL signal resolved by the TM-OSL method. Radiation Measurements 121, 32-36.

Geology Optically stimulated Luminescence dating of quartz (OSL) Learn more Infrared stimulated Luminescence dating of feldspar (IRSL) Learn more Single grain/spatially resolved luminescence dating Learn more Radiofluorescence Learn more Electron Spin Resonance (ESR) dating of quartz Learn more Pulsing: mixed mineral samples Learn more

Archaeology Flint and other heated rocks Learn more Ceramics, pottery, bricks and statues Learn more Unheated rock surfaces Learn more Tooth enamel and quartz grains Learn more Sediment dating Learn more

Solid state dosimetry Luminescence spectroscopy Learn more Spatially resolved luminescence Learn more Time resolved luminescence Learn more Electron Spin Resonance (ESR) Learn more

Epitaxial Layers & Thin Films Guaranteeing specifications in Semiconductor front-end processes Analyze wafer properties during wafering and front-end processes Near-surface wafer properties play a crucial role in determining the outcomes of subsequent processes. Tight control over structural and electronic conditions is essential to prevent yield loss during this critical phase. Using XRD series , you precisely control crystal cuts, ensuring consistent quality for device processing every day. With MDP series and HR-SPS series , you monitor the recombination behavior of optically generated charge carriers. This approach supports a wide range of applications, from optoelectronics to power and logic devices! Key Advantages Manual or automated Whether for R&D or Quality Control, we offer the flexibility to integrate metrology units with automation solutions or design cost-efficient, streamlined standalone systems. Highest precision Our unmatched combination of precision, speed, and modularity sets us apart. Put our method to the test with your application – challenge us to deliver! Material flexibility We offer solutions for almost any thin film or bulk material system with a band gap. Challenge us with your process requirements – we're ready to innovate! Onsite service and training Reduce your total cost of ownership by participating in our on-site training program! We empower you to perform first- and second-line servicing on your tools, ensuring maximum uptime and full control over your process – no matter your location or access limitations. Offcut management for front-end processes Implement 100% wafer offcut entry control for your front-end processes. This enables you to screen offcuts from materials like SiC or InP substrates, ensuring optimal results in epitaxy, lithography, and ion implantation. Single crystal rocking curve With an optional module, you can activate an essential X-ray metrology feature. Perform baseline quality control using X-ray rocking curves and analyse the FWHM of SiC wafers. Our Industry-Leading Solutions XRD series Explore more SDCOM Learn more Wafer XRD Learn more Omega/Theta XRD Learn more MDP series Explore more MDPmap Learn more MDPspot Learn more MDpicts Learn more MDpicts pro Learn more HTpicts Learn more SPS/SPV series Explore more HR-SPSmap with fixed energy excitation sources Learn more HR-SPSmap with variable energy excitation source Learn more DPM series Explore more DPM100 Learn more Expertise in Materials Si SiC InP GaAs Ga₂O₃ Ge and more Get in touch Do not hesitate to contact us – we are available to assist you with any inquiries or requests. Use our inquiry tool or reach out via email: sales @ freiberginstruments.com Discover More Solutions Crystal Growth and Processing Learn more Photovoltaic Learn more Luminescence Dating and Dosimetry Learn more Research and Development Learn more

Research and Development Versatile Measurement solutions to empower and accelerate your R&D progress As a spin-off of the technical university in Freiberg, Freiberg Instruments has a strong scientific background and never stopped cooperating with scientific partners in a variety of research projects to develop measurement tools for the scientific community. Our tools come with a lot of options and accessories to offer tailored solutions to your research needs. Freiberg Instruments even offers customized solutions to ensure top notch research work. Discover R&D Projects Key Advantages Determine exact defect properties Enable temperature dependent measurements in a wide range of temperatures to determine the activation energy of defects High Accuracy and reproducibility High repeatability and reproducibility of all our products as well as reference samples and certificates ensuring traceable to highest standards High measurement speed and sensitivity Unsurpassed sensitivity and measurement speed for crystal orientation as well as lifetime measurements Versatile tools for ingots, wafers and even thin films We offer tools for all kinds of different sample geometries from large ingots (up to 850 mm length) to thin films (1 µm thickness and less) Temperature dependent measurements In order to investigate defects in semiconductors temperature dependent methods are an ideal method to determine activation energies. Usually for these methods it is necessary to form contacts on the samples, which can be very complicated and often alter the samples due to annealing steps. MDpicts is a non-destructive, contactless method with which the activation energies and capture cross sections of defects can be determined with a high accuracy. Investigation of surface and bulk quality The separation of bulk and surface quality is one of the main challenges of lifetime measurements. Freiberg Instruments offers a variety of different wavelength with different penetration depth and pulse length as well as estimations for bulk lifetime. Our Innovative Solutions XRD series Explore more DDCOM Learn more SDCOM Learn more MDP series Explore more MDPmap Learn more MDpicts pro Learn more MDpicts Learn more MDPspot Learn more HTpicts Learn more SPS/SPV series Explore more HR-SPSmap with fixed energy excitation sources Learn more HR-SPSmap with variable energy excitation source Learn more DPM series Explore more DPM100 Learn more Our Partners Get in touch Do not hesitate to contact us – we are available to assist you with any inquiries or requests. Use our inquiry tool or reach out via email: sales @ freiberginstruments.com Discover More Solutions Crystal Growth and Processing Learn more Epitaxial Layers & Thin Films Learn more Photovoltaic Learn more Luminescence Dating and Dosimetry Learn more

Crystal Growth and Processing Solutions for Unrivaled Precision in Crystal Orientation Enhancing Accuracy in Grinding and Sawing: Optimize your Crystal Processing Freiberg Instruments sets new standards in crystal growth and processing with state-of-the-art metrology solutions. Our advanced tools ensure precise alignment of high-mobility crystal directions with transistor channel orientations, enabling peak performance in semiconductor and material fabrication industries. Key Advantages Tailored to your workflow Every fab is unique, like a living organism. Our tools are meticulously designed to seamlessly integrate into your material workflows and data processing systems. Highest precision Our method stands unrivalled in combining precision, speed, and 3D crystal orientation. Leveraging our proprietary algorithms, we calculate the optimal cylinder and empower cost-efficient process tools with a single Ingot XRD solution. Comprehensive seed-to-wafer solution framework We provide tailored solutions for every stage of oriented crystal manufacturing, offering a wide range of customized options to meet market demands. Bring us your toughest process challenges – we're ready to deliver! Onsite service and training Reduce your total cost of ownership by participating in our on-site training program! We empower you to perform first- and second-line servicing on your tools, ensuring maximum uptime and full control over your process – no matter your location or access limitations. Precision in Every Step XRD series Explore more Ingot XRD Learn more Ingot XRD SiC Learn more Omega/Theta XRD Learn more Expertise in Materials Si SiC InP GaAs Ga₂O₃ Ge and more Future-Proof Your Manufacturing Process As industry demands evolve, so do our solutions. Freiberg Instruments remains at the forefront of innovation, helping clients optimize efficiency, investigate defects, and maintain a competitive edge in crystal growth and processing. Revolutionize your ingot grinding preparation with Ingot XRD 300 OD/Notch Get in touch Do not hesitate to contact us – we are available to assist you with any inquiries or requests. Use our inquiry tool or reach out via email: sales @ freiberginstruments.com Discover More Solutions Epitaxial Layers & Thin Films Learn more Photovoltaic Learn more Luminescence Dating and Dosimetry Learn more Research and Development Learn more

p/n detection in bricks Changes in the conduction type of a multicrystalline brick are frequently observed, due to a high phosphorus concentration in the low quality feedstock. (Alttext kürzen, da zu lang)) In the PV industry sometimes also low quality material with a high phosphorous concentration is used. Phosphor has a segregation coefficient of 0.35 and is therefore segregating in the top of the brick (last part that solidifies).There the concentration can be so high, that even changes in the conduction type from p to n can occur. Of course the n-type material cannot be used anymore for the solar cell production. Before the conduction type changes completely to n-conductivity, there is a narrow part of the ingot that is highly compensated and has a very high resistivity. Since resistivity measurements by eddy current are difficult to achieve in high resolution, it is preferable to use the photoconductivity for the detection of such a pn change. The photoconductivity or signal height depends on the resistivity because the skin depth of the microwave increases with increasing resistivity, so that at high resistivities a larger volume of the sample is measured. This dependency can be used for the pn detection. With a clever computer algorithm, it is possible to detect the sharp rise in photoconductivity, so that a pn-change can be detected with a resolution of 1 mm (fig.1 and fig.2). This algorithm can be implanted into the software of the MDPingot and MDPingot inline tool. The MDPingot and MDPingot inline allows to detect pn-changes inline with a resolution of 1mm as demonstrated in figure 1 and 2. With this feature useless n-material can be sorted out as early as possible in the production process. For more information please read: [1] N. Schüler, D. Mittelstrass, K. Dornich, J.R. Niklas, 35th IEEE Photovoltaic Specialists Conference Honululu, (2010) 852-857 Fig. 1: photoconductivity map of a mc-Si brick with the indicated detection brick height of the pn algorithm and height at which the mean resistivity linescan rises above 3 cm Fig. 2: mean photoconductivity linescan along with the output of the pn detection algorithm and the mean resistivity linescan Related Solutions and Industries: Epitaxial Layers & Thin Films Matching Products MDP series MDPpro 850+ Advanced Solution for Quality Control of Monocrystalline Silicon Ingots, Bricks, and Wafers Learn more MDP series MDPpro Advanced Lifetime Measurement System for Quality Control and Material R&D on Semiconductors Learn more Get in touch Do not hesitate to contact us – we are available to assist you with any inquiries or requests. Use our inquiry tool or reach out via email: sales @ freiberginstruments.com

Automatic Wafer Sorting For microelectronics, and other microstructure technologies, crystalline wafers High-Precision Wafer Testing with Omega-Scan To ensure the exceptional performance required for semiconductors, every wafer must undergo thorough testing. The Omega-Scan method, known for its speed and precision, is ideal for fully automated in-line X-ray diffraction (XRD) solutions. It enables comprehensive surface characterization, including surface tilt vector analysis and in-plane direction measurement—such as perpendicular alignment to the wafer flat. Additionally, it provides automated detection of wafer flats or notches along with their precise measurements. Omega-Scan solutions are available for all standard wafer materials and orientations. Quartz remains the most commonly used material, where integrating mapping technology proves especially beneficial. By identifying high-quality wafer regions before cutting blanks, the process ensures optimal material utilization. During wafer production, heat-induced stress can cause bending, leading to warp and bow. See Fig 1 & 2. An optional sensor accurately measures these deformations, ensuring precise quality control. Fig. 1 - Warp and bow measument with a line laser instrument attached to the diffractometer Fig. 2 - Sapphire wafer surface geometry as the result of the warp and bow measurement Related Technologies: Omega-scan , Theta-scan Related Solutions and Industries: Epitaxial Layers & Thin Films Matching Products XRD series Wafer XRD for fully automated sorting, sample crystalline orientation, sample dimension, optical notch/flat and edge profile determination and more Learn more XRD series Quartz Wafer XRD Enable tight frequency specs in mass production Learn more XRD series Angle Sorter This product launching soon Learn more Get in touch Do not hesitate to contact us – we are available to assist you with any inquiries or requests. Use our inquiry tool or reach out via email: sales @ freiberginstruments.com